On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

@article{citeulike:2674775, abstract = {Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chip}, author = {Grass, E. and Tittelbach-Helmrich, K. and Jagdhold, U. and Troya, A. and Lippert, G. and Kruger, O. and Lehmann, J. and Maharatna, K. and Dombrowski, K. F. and Dombrowski, K. F. and Fiebig, N. and A10 and Kraemer, R. and A11 and Mahonen, P. and A12}, booktitle = {Personal Communications, IEEE [see also IEEE Wireless Communications]}, citeulike-article-id = {2674775}, doi = {10.1109/98.972168}, journal = {Personal Communications, IEEE [see also IEEE Wireless Communications]}, keywords = {80211, wifi, wlan}, number = {6}, pages = {48--57}, posted-at = {2008-04-15 19:16:37}, priority = {2}, title = {On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem}, url = {http://dx.doi.org/10.1109/98.972168}, volume = {8}, year = {2001} }

TY - JOUR ID - citeulike:2674775 L3 - citeulike-article-id:2674775 TI - On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem T2 - Personal Communications, IEEE [see also IEEE Wireless Communications] JF - Personal Communications, IEEE [see also IEEE Wireless Communications] VL - 8 IS - 6 SP - 48 EP - 57 N2 - Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chip KW - 80211 KW - wifi KW - wlan AU - Grass, E AU - Tittelbach-Helmrich, K AU - Jagdhold, U AU - Troya, A AU - Lippert, G AU - Kruger, O AU - Lehmann, J AU - Maharatna, K AU - Dombrowski, KF AU - Dombrowski, KF AU - Fiebig, N AU - A10 AU - Kraemer, R AU - A11 AU - Mahonen, P AU - A12 PY - 2001/// UR - http://dx.doi.org/10.1109/98.972168 ER -