New multilayer techniques actualizing active antenna hardware for wireless communication systems

by: T Hori, T Seki

Antennas and Propagation, 2001. Eleventh International Conference on (IEE Conf. Publ. No. 480), Vol. 2 (2001), pp. 479-483 vol.2.

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Abstract

We proposed new multilayer techniques in order to actualize planar active antenna hardware. We proposed a multilayer substrate that combines ceramic and polyimide substrates to realize compact active antennas, and a multilayer substrate that combines Teflon and polyimide substrates using the bump technique to realize large active antennas. The experimental results verify that the proposed multilayer substrates realize planar active array antennas that exhibit higher performance in the millimeter wave band

@inproceedings{citeulike:2774723, abstract = {We proposed new multilayer techniques in order to actualize planar active antenna hardware. We proposed a multilayer substrate that combines ceramic and polyimide substrates to realize compact active antennas, and a multilayer substrate that combines Teflon and polyimide substrates using the bump technique to realize large active antennas. The experimental results verify that the proposed multilayer substrates realize planar active array antennas that exhibit higher performance in the millimeter wave band}, author = {Hori, T. and Seki, T. }, booktitle = {Antennas and Propagation, 2001. Eleventh International Conference on (IEE Conf. Publ. No. 480)}, citeulike-article-id = {2774723}, journal = {Antennas and Propagation, 2001. Eleventh International Conference on (IEE Conf. Publ. No. 480)}, keywords = {active, antenna, communication, hardware, multilayer, wireless}, pages = {479--483 vol.2}, posted-at = {2008-05-09 09:31:52}, priority = {2}, title = {New multilayer techniques actualizing active antenna hardware for wireless communication systems}, url = {http://ieeexplore.ieee.org/xpls/abs\_all.jsp?arnumber=928056}, volume = {2}, year = {2001} }

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TY - CONF ID - citeulike:2774723 L3 - citeulike-article-id:2774723 TI - New multilayer techniques actualizing active antenna hardware for wireless communication systems T2 - Antennas and Propagation, 2001. Eleventh International Conference on (IEE Conf. Publ. No. 480) JF - Antennas and Propagation, 2001. Eleventh International Conference on (IEE Conf. Publ. No. 480) VL - 2 SP - 479 EP - 483 vol.2 N2 - We proposed new multilayer techniques in order to actualize planar active antenna hardware. We proposed a multilayer substrate that combines ceramic and polyimide substrates to realize compact active antennas, and a multilayer substrate that combines Teflon and polyimide substrates using the bump technique to realize large active antennas. The experimental results verify that the proposed multilayer substrates realize planar active array antennas that exhibit higher performance in the millimeter wave band KW - active KW - antenna KW - communication KW - hardware KW - multilayer KW - wireless AU - Hori, T AU - Seki, T PY - 2001/// UR - http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=928056 ER -

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